Warpage Analysis in LCD Panel under Moisture Diffusion and Hygroscopic Swelling
نویسندگان
چکیده
منابع مشابه
Swelling Bulk Density and its Application in Arya and Paris Model for Soil Moisture Curve Prediction
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ژورنال
عنوان ژورنال: Journal of Japan Institute of Electronics Packaging
سال: 2009
ISSN: 1343-9677,1884-121X
DOI: 10.5104/jiep.12.144